Home Organisation Registry CEA-Leti

CEA-Leti

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    SME category includes:

    Micro-enterprises:

    Micro-enterprises are defined as enterprises that employ fewer than 10 persons and whose annual turnover or annual balance sheet total does not exceed EUR 2 million.

    Small enterprises:

    Small enterprises are defined as enterprises that employ fewer than 50 persons and whose annual turnover or annual balance sheet total does not exceed EUR 10 million.

    Medium-sized enterprises:

    Medium-sized enterprises are defined as enterprises that employ fewer than 250 persons and either have an annual turnover that does not exceed EUR 50 million, or an annual balance sheet not exceeding EUR 43 million.

    Mid-cap enterprises:

    Mid-cap enterprises are considered as enterprises that employ fewer than 3000 persons.

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    • RTO
  • Value Chain Position:
    Components | Masters & Tools
The CEA: a key player in technological research The French Alternative Energies and Atomic Energy Commission (CEA) is a key player in research, development and innovation in four main areas: defence and security, low carbon energies (nuclear and renewable energies), technological research for industry, fundamental research in the physical sciences and life sciences.​

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CEA-Leti

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    Technical Marketplace

    Origination – MicroLens Array

    Member

    Origination – MicroLens Array

    CEA-Leti offers a wafer-scale micro-lens array prototype made from silicon (Si) and silicon dioxide (SiO₂), utilizing dry and wet etching with lithography. The array is customized to client specifications, enabling microlenses as small as 2 μm with no gaps. The lens arrays can span a full wafer (200 mm Si) or smaller areas as needed, with guaranteed uniformity across the surface. Applications span various markets, including AR/VR, automotive, consumer electronics, healthcare, and imaging. The technology accommodates lens diameters from 2 μm up to 100 μm, with a concave shape and a maximum height of 5 μm.

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    NanoImprint at wafer-scale

    Member

    NanoImprint at wafer-scale

    CEA offers wafer-scale nanoimprinting services using soft UV-NIL technology, ideal for industries like AR/VR, automotive, and healthcare. This method enables high-throughput patterning on silicon or glass wafers with features down to nanometers. Key specifications include minimum pattern widths of 45 nm, high uniformity (<1% variation), and low defectivity (<10 defects/cm²). Capabilities support 2D, 3D, and freeform shapes, allowing versatile design for custom optical applications.

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