Drilling & Cutting – Value Chain Positions

Sony DADC

Sony DADC is a leading global manufacturer and service provider for optical media. With nearly 40 years of experience in entertainment and a strong focus on quality, innovation, and customer satisfaction, we’ve expanded into polymer micro optics, offering refractive and diffractive components on full polymer wafers. Our 30+ engineers enable efficient large scale production. At our 41,000 m² site in Thalgau, Austria, we operate a 6,000 m² ISO 7 clean room with top tier security.

WOP | Workshop of Photonics

WOP is an expert in femtosecond laser micromachining, serving industrial and scientific clients worldwide. With over 20 years of experience, we deliver fully integrated solutions: from feasibility studies and prototyping to micromachining services and laser workstations. Ultrashort pulse laser capabilities enable us to work with a wide range of materials and offer ultra-high precision solutions for Semiconductors, Optical Communications, Medical, Defense, Automotive, and Scientific fields.

Corning Laser Technologies GmbH

Corning Laser Technologies GmbH (CLT) is part of Corning Incorporate in the US and focusses on laser glass processing. CLT provides processing tools with innovative laser glass cutting and drilling technologies that have distinct advantages over conventional processes. We are offering a unique dicing solution for glass wafers that can be used to singulate parts for micro-fluidic, micro-optical, meta-surface on glass and glass-based semiconductor applications.