Aspherical microlens and MLA on silicon and glass wafer
-
Offering type ?
PRODUCT:
Component or system, which is commercialized. It is available for ordering multiple pieces and liability is assumed by the provider/seller. Necessary certification of the product was obtained (e.g. CE certification). The product sheet and/or conditions of use are defined.
PROTOTYPE:
Component or system, which has been successfully tested under real or real-like conditions. The prototype is not commercialized as the main purpose is to use it for demonstration and experimentation, including user and market acceptance.
TECHNICAL SERVICE:
Tools and processes and its combination, which are necessary to prepare and test prototypes or products.
- Volume production
-
Market
- AR/VR
- Automotive
- Imagers & Displays
- Optical communication
- Optical instrumentation
-
Manufacturing Pillar
- Wafer-scale
-
Technology
- Dry Etching
- Photolitho
- Thermal Reflow
- Wet Etching
We offer micro-optics including microlenses, lens arrays, diffractive optical elements (DOE)s. Our micro-optics products can enable all kinds of optical transceivers in Communication, 3D sensing & Lidar, and also serve for beam shaping in industrial & medical tools.
Offering Description
Axetris is a leading manufacturer of micro-optics including microlenses, lens arrays, diffractive optical elements (DOE)s. Our micro-optics products can enable all kinds of optical transceivers in Communication, 3D sensing & Lidar, and also serve for beam shaping in industrial & medical tools. We offer further micro-fabrication and MEMS processes on top of micro-optics products, which allow adding more mechanical and metallic features for assembly and higher integration density at the wafer level. Those fabrication foundry services can be applied to CMOS wafers
Offering Specifications
- Lens Diameter: 10 – 2,000 μm
- Lens shape: Circular & Cylindrical
- Lens surface profile: Aspheres
- Wavelength: UV-Visible-IR
- Optical communication: O-band & C-band
- Wafer Materials: Fused silica, glass, silicon
- Wafer thickness
- Fused silica: 0.2 – 1.8m
