Etched Microlenses
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Offering type ?
PRODUCT:
Component or system, which is commercialized. It is available for ordering multiple pieces and liability is assumed by the provider/seller. Necessary certification of the product was obtained (e.g. CE certification). The product sheet and/or conditions of use are defined.
PROTOTYPE:
Component or system, which has been successfully tested under real or real-like conditions. The prototype is not commercialized as the main purpose is to use it for demonstration and experimentation, including user and market acceptance.
TECHNICAL SERVICE:
Tools and processes and its combination, which are necessary to prepare and test prototypes or products.
- Volume production
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Market
- Imagers & Displays
- Optical instrumentation
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Manufacturing Pillar
- Wafer-scale
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Technology
- Dry Etching
- Photolitho
- Thermal Reflow
- Other
Focuslight provides wafer-scale etched microlenses for imaging, displays, and optics. Made from fused silica or silicon, they offer NAs of 0.09–0.6 and customizable arrays. Using reflow, photolithography, and dry etching, they ensure high precision for fiber optics, photonics, and laser systems.
Offering Description
Focuslight is committed to providing the highest quality components underpinned by cutting edge manufacturing techniques. Combined with a unique blend of people skills, its innovative advances in technology make Focuslight a leader in its product offerings.
Focuslight provides a broad range of customized microlenses for efficient collimation and light coupling for fiber optics, as well as Si-Photonics, PIC, WSS, laser diodes, VCSEL, CWDM, DWDM and more. These MLA’s can be used for the visible and infrared applications.
KEY FEATURES
+ 1D & 2D microlens arrays + Highest quality and precision + Bulk material: fused silica, silicon, borofloat + Wavelength range: DUV to Mid-IR + Lens profile: sphere, asphere + Sub-micron position accuracy
ADDITIONAL FEATURES
+ Trenches for glue stops and glue pockets, pupils, pinholes, alignment marks, mounting posts + Double-sided lens arrays with precise frontto-back alignment + AR coating, metallization, wafer-level packaging + Wafer thinning
Offering Specifications
- Materials: Fused silica (various grades), silicon
- Numerical aperture (NA) – Typically 0.09 to 0.6
- Mode Field Diameter (MFD) – 0.6 μm to 50 μm
- Beam Diameter/Output – 50 to 400 µm, others on request
- Fiber/Waveguide types – SMF, MMF, LD, PIC,
- Si-Photonics Back focal distance – Typically 0 to 300 μm
- Pitch – 82 μm, 125 µm, 250 µm, 500 µm, 750 µm, and custom pitch
- Lens type – Circular, cylindrical
- Lens profile – Spherical, aspheres, DOE
- Arrays Linear, quadratic, hexagonal, custom
