CEA-Leti offers a wafer-scale micro-lens array prototype made from silicon (Si) and silicon dioxide (SiO₂), utilizing dry and wet etching with lithography. The array is customized to client specifications, enabling microlenses as small as 2 μm with no gaps. The lens arrays can span a full wafer (200 mm Si) or smaller areas as needed, with guaranteed uniformity across the surface. Applications span various markets, including AR/VR, automotive, consumer electronics, healthcare, and imaging. The technology accommodates lens diameters from 2 μm up to 100 μm, with a concave shape and a maximum height of 5 μm.